Amtest - no. 1 SMT distributor in Central and Eastern Europe

Latest news

  • 30/04/2020

    Welcome to the team

    We are proud to announce our newest team members Barnabás Szalai and Csaba Szabó. See more details

  • 28/02/2020

    Nano Dimension the world leading 3D-printing electronics company have teamed up with Amtest Group

    Nano Dimension the world leading 3D-printing electronics company have teamed up with Amtest Group in the countries of Romania, Hungary, Poland, Slovenia, Serbia, Croatia and Bulgaria. See more details

  • 16/01/2020

    Amtest Group and X-Treme Series sign exclusive distribution agreement

    Amtest Group and X-Treme Series sign exclusive distribution agreement covering Romania, Hungary, Poland, Slovenia, Serbia, Croatia and Bulgaria. See more details

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Wire Bonding


F & K Delvotec

F & K DELVOTEC are specialists for assembly and joining technologies who are committed to continuing to develop reliable and efficient products and solutions for connecting electronic components since they were founded in 1978.

Thanks to a tried and tested technology platform and comprehensive solutions for automation, wire bonders from F & K DELVOTEC are more varied and reliable than any other machine family of its type in the world.

High innovation and flexibility have been their secret for success for decades: exchanging bond heads on all M17 wire bonding machines in under 15 minutes, comprehensive solutions for automation and handling, applicable from small series to mass production and last, but not least, all current wire bond processes are covered.

The tried and tested technology building blocks create a final, unbeatable argument for the M17 in zero failure manufacture, in Automotive, Sensor production, PV-Industry and E-Mobility.

Among the trade marks for the unique M17 platform are, standard bond heads, extremely precise piezo and linear drives, finely-adjusted drive and control technology, vibration suppressed chassis, drive and control software and camera supported quality tools during and after the process.

With the world premier of their Ultrasonic-laser bonder in 2015, F & K DELVOTEC GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology.

The completely new process, based on laser micro-welding, is particularly suitable for joining bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With Ultrasonic-laser bonding the application of ribbon bonding for much higher currents is accomplished.